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range of industries within the field of technology
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Principal Engineer in Package Electromagnetic Simulations and Design
Recruitment Consultant
Jet Dela Cruz
Contact Details
Posted
2 months ago
Principal Engineer in Package Electromagnetic Simulations and Design (m/f/d)
Â
Responsibilities
- Perform 3D electromagnetic simulations of novel package concepts and give guidelines on package optimization based on three main aspects (mechanical, thermal and electrical), together with package experts
- Support Application board design and optimization for novel device concepts and for advanced application testing
- Play an active role in the Virtual Prototype System-Level Approach Development at Huawei NRC. In the field of Package/Board optimization and act as interface between the device technology group and the application engineering group
- Benchmark with measurements and interface with application engineers and validate application simulations with measurements
Requirements
- Master or PhD Degree in Electrical Engineering, Physics or any other related disciplines
- Profound work experience in the field of Electromagnetic Modeling, Semiconductor Device Physics
- Experience in the semiconductor industrial environment
- Experienced with Electromagnetic Simulation Tools, like Ansys Q3D, Comsol
- Fluent in written and spoken English, working language
Industry
Semiconductor
Contract Type
Permanent
Location
Germany
Work Model
On-Site
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